Explore Our X-ray Solutions
X-9200 / X-9200L
X-9200L Semiconductor Inspection System Achieving a minimum detection accuracy of 1 µm, this system is designed for high-precision testing of integrated circuit chips and semiconductor components, including: • BGA • IGBT • Flip chips • PCBA soldering • LED bonding • IC packaging It is widely used in industries requiring ultra-fine defect detection and quality control in semiconductor manufacturing and assembly.
- X-ray Voltage: 130KV/ 90KV
- Spatial Resolution: 3μm/5μm
- Detector: 1536x1536px
- Inspection Area: 680x660mm / 620x1200mm
XC-3100 Blue
Simultaneous counting of different reels, simultaneous imaging, automatic numbering/ counting. Reduce the number of processes, shorten the process route, and improve efficiency.
- Accuracy: 99.99% (0201 as an example)
- Miscalculation Rate: ≤0.01% (0201 as an example)
- Minimum part size that can be detected: 01005
- Counting Speed: 6-10s /4 reels (CHIP 0201)
XC-3100 white
Simultaneous counting of different reels, simultaneous imaging, automatic numbering/ counting. Reduce the number of processes, shorten the process route, and improve efficiency.
- Accuracy: 99.99% (0201 as an example)
- Miscalculation Rate: ≤0.01% (0201 as an example)
- Minimum part size that can be detected: 01005
- Counting Speed: 6-10s /4 reels (CHIP 0201)
XC-3100-inline
The 3100 inline X-ray component counter supports automated inventory counting of reel-based components. It can be integrated with EMS systems for real-time data uploading, significantly reducing labor, processing time, and inventory management costs.
- Accuracy: 99.99% (0201 as an example)
- Miscalculation Rate: ≤0.01% (0201 as an example)
- Minimum part size that can be detected: 01005
- Counting Speed: 9-15s / reel (CHIP 0201)