Solutions
PCB & PCBA Inspection
X-ray inspection supports both bare PCB process verification and assembled-board quality control. For multilayer PCBs, it can evaluate drill-to-pad registration, via alignment, target positioning and selected inner-layer structural abnormalities.
For PCBAs, X-ray reveals hidden solder joints beneath BGA, CSP, QFN and other bottom-terminated components, helping identify bridging, open joints, insufficient solder, voiding, ball displacement and head-in-pillow defects. Dense or double-sided assemblies may require laminographic or 3D inspection to reduce structural overlap.
Power Semiconductor & IGBT Inspection
Power semiconductor modules contain multiple soldered and bonded interfaces that are critical to electrical and thermal performance. X-ray inspection helps visualize and quantify voiding in die-attach and substrate solder layers and can also reveal bond-wire routing abnormalities, internal misalignment and assembly defects.
For dense modules with overlapping structures or thick copper heat spreaders, oblique imaging, computed laminography or CT may be used to separate critical interfaces and improve defect visibility.
IC & Semiconductor Package Inspection
High-resolution X-ray imaging provides a non-destructive view of internal semiconductor package structures, including bond wires, die placement, solder bumps and die-attach regions. It supports the detection of wire sweep or breakage, bump misalignment, bridging, missing connections, voiding and foreign material.
Tilted views or 3D inspection can be applied when overlapping internal structures limit interpretation in a single 2D projection.
LED & Lighting Module Inspection
LED strips and lighting modules combine semiconductor packages, solder joints, thermal pads and flexible or rigid circuit substrates. X-ray inspection can examine concealed solder connections and package structures to identify voids beneath thermal pads, insufficient solder, bridging, component misalignment and selected bond-wire abnormalities.
Lithium-Ion Battery Inspection
X-ray and CT inspection provide a non-destructive view of the internal construction of cylindrical, prismatic and pouch cells. Typical inspection targets include electrode alignment and overhang, winding or stacking condition, folded or damaged layers, foreign particles, tab position, weld quality and internal assembly abnormalities.
The most suitable imaging method should be selected according to cell format, material density, required resolution and production cycle time.
SMT Material Management & Component Counting
X-ray component counting determines the quantity of components inside reels without manually unwinding or opening the packaging. The system analyzes the projected component pattern and reel geometry to deliver fast, repeatable inventory results.
Depending on the selected configuration, the solution may also support barcode identification, automatic label printing, material traceability and integration with MES, WMS or ERP systems. Counting accuracy and cycle time should always be stated according to the specific machine model, component type and packaging condition.