Professional X-ray inspection systems for PCB assemblies, semiconductors, electronic components, batteries, automotive parts and industrial castings.
The X-225T-CT is designed for non-destructive inspection of aluminum castings, detecting internal defects such as cracks, shrinkage porosity, gas pores, and sand holes. Its CT imaging capability enables detailed evaluation of complex and safety-critical components, helping manufacturers ensure quality and reduce rejection losses.
The X-160-Pro is designed for non-destructive inspection of aluminum castings, detecting internal defects such as cracks, shrinkage porosity, gas pores, and sand holes. It helps manufacturers ensure product quality, reduce rejection losses, and meet the inspection requirements of safety-critical components.
The X-160T-M is designed for non-destructive inspection of aluminum castings, detecting internal defects such as cracks, shrinkage porosity, gas pores, and inclusions. It helps manufacturers ensure product quality, reduce rejection losses, and meet the growing inspection requirements for safety-critical aluminum components.
An automatic inline reflow inspection system listed in the AXI-9200L series, with 1710mm*300mm effective inspection range and loading/unloading time of 12s per cycle.
AXI XC3100 Electronic Semiconductor Inline Inspection System is used for high-precision testing in the automatic detection of integrated circuit chip semiconductors, such as BGA, IGBT, flip-chip, PCBA component soldering, LED, photovoltaic, and other industries.
The AXI-9900 inline X-ray inspection system enables fully automated batch inspection without manual loading or unloading. It automatically switches the X-ray tube on and off, analyzes inspection results, and identifies products as OK or NG.
X-7900 ultra (3D/CT) Semiconductor Inspection System features a minimum detection accuracy of 1μm and is used for high-precision testing of integrated circuit chip semiconductors, such as BGA, IGBT, flip-chip,PCBA component soldering, LED bonding, IC packaging.
X-7900 Ultra (3d/ct) Read More »
X-9200L Semiconductor Inspection System Achieving a minimum detection accuracy of 1 µm, this system is designed for high-precision testing of integrated circuit chips and semiconductor components, including:
• BGA
• IGBT
• Flip chips
• PCBA soldering
• LED bonding
• IC packaging
It is widely used in industries requiring ultra-fine defect detection and quality control in semiconductor manufacturing and assembly.
X-7900 (AXI) semiconductor inline inspection system is designed for high-precision automated inspection of integrated circuit chips and semiconductors, including but not limited to BGA, IGBT, flip chips, and PCBA component soldering. It is widely used in industries such as LED manufacturing and photovoltaics for high-accuracy testing.
The X-7900 semiconductor X-ray inspection system can detect defects as small as 3 μm. It supports one-click measurement of void size and void ratio, with up to 400× geometric magnification and 2,500× image-system magnification.