X-7900 Ultra (3d/ct)
Tube Voltage
160KV
Focal Spot Size
1μm
Geometric Magnification
2000X
Stage Size
670x670mm
Inspection Area
600x600mm
Detector Resolution
1536x1536px
X-7900 ultra (3D/CT) Semiconductor Inspection System features a minimum detection accuracy of 1μm and is used for high-precision testing of integrated circuit chip semiconductors, such as BGA, IGBT, flip-chip,PCBA component soldering, LED bonding, IC packaging.
Technical Specifications
Model
X-7900ULTRA (3D/CT)
X-ray Tube Type
Open Tube
Focal Spot Size
1μm
Tube Voltage
160KV
Tube Current
500μA
Geometric Magnification
2000X
System Magnification
7500X
Detector Resolution
1536x1536px
A/D Conversion
16bit
Frame Rate
20fps
Detector Tilt Angle
±70°
Stage Size
670x670mm
Inspection Area
600x600mm
Maximum Load
≤10kg
Machine Dimensions
1578x1675x1910mm(L*W*H)
Machine Weight
2200KG
Operating System
Win11
Power Supply
AC110-220V 50-60Hz
Rated Power
1200W
Radiation Leakage
<1μSv/H