X-9200 / X-9200L

X-9200L Semiconductor Inspection System Achieving a minimum detection accuracy of 1 µm, this system is designed for high-precision testing of integrated circuit chips and semiconductor components, including:
• BGA
• IGBT
• Flip chips
• PCBA soldering
• LED bonding
• IC packaging
It is widely used in industries requiring ultra-fine defect detection and quality control in semiconductor manufacturing and assembly.